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PHI-5000 Versaprobe II Introduction

 

Introduction:

X-ray photo-electron spectroscopy (XPS) is one of the most widely used surface analytical techniques in field of material science and development.  The principle is to use a soft X-ray beam (Usually, the Anode is Al K-alpha, Ma K-alpha) as the primary source, to irradiate the surface of sample, which results in the electrons emitted from the atomic core level.  Basing on the measured Kinetic energy of the photo-electrons emitted, the Binding energy of photo-electron can be known according the law of energy conservation.

 

The PHI 5000 Versaprobe II (VP-II) provides high performance micro-area spectroscopy, chemical imaging, and secondary electron imaging with a raster scanned 10 μm diameter x-ray beam.  The x-ray beam size can be computer controlled from less than 10 μm diameter to 400 μm diameter for high sensitivity.  And Capabilities of acquiring Chemical status mapping and sputtering depth profiling of conductive and insulated materials, such as catalysts, metals, and electronic devices, glass and polymers, even the bio-material and tissues.  The VP II maintains the core capabilities of PHI 5000 Versaprobe, including scanning and focusing X-ray, patented dual beam neutralization using a combination of low energy ions and electrons, lower energy floating ion gun.  The optional C60 ion gun provides a unique and powerful sputter depth profiling capability for many organic materials.  A fully automated five axis sample manipulator facilitates the automatic analysis of multiple samples and provides Zalar RotationTM capabilities for Argon or optional C60 sputter depth profiling.  The new operational interface, SMARTSOFT-XPS, together with the PHI MutliPak software provides an easy-to-use platform for multi-technique instrument control, data interpretation and manipulation.  In a summary, the performance of VP II is significantly improved.

 

 

Fig. 1 - PHI 5000 Versaprobe II

Features:

  • Smallest X-ray beam size: The x-ray source utilizes a focused electron beam scanned upon an Al anode for x-ray generation and a quartz crystal monochromator that focuses and scans the generated x-ray beam upon the sample surface.  The smallest probe size achieved by ULVAC-PHI is 10um.  None of any style apertures are used to control and govern the probe size of X-ray.  The following pictures show the performance of focused and scanned X-ray beam.

 

          Fig.2 - SXI image (Geller MRS-3 Image Calibration Sample with Patterned ITO Features)

 

                         3 (a)                            3 (b)                  

Fig.3 - a) In 3d XPS map, b) In 3d XPS line scan

 

  • Precisely locate Region of Interest: the SEM-like function, called SXI image, can lively shows the surface topography of sample.  It is very convenient for the user to navigate the SXI image, then the user can easily define the analysis region by pick-click.  Even the invisible features in normal photo image, maybe easily find and locate from the SXI image.

  

Fig.4 - a) SXI image, b) narrow scan spectrum in area 1 and 2, c) survey spectrum at point 4

 

  • Highest sensitivity with smallest probe size: The PHI VersaProbe II is driven by a patented high flux X-ray source providing a focused monochromatic x-ray beam that can be scanned upon the sample surface.  Performance on Ag 3d5/2 peak with 10 µm diameter x-ray beam list as following table.

Peak Width (FWHM/eV)

Sensitivity (cps) @ 10um X-ray spot

0.60

4,000

1.00

12,000

1.30

15,000

 

  • Versatile techniques platform:the following options can be equipped basing on requirement of research.
    • 10 keV C60 ion gun
    • Dual anode, non-monochromatic x-ray source
    • UV light source for UPS
    • 95 mm sample handling
    • Hot / cold sample handling
    • Optional Electron Gun for AES
    • Vacuum Transfer Vessel

 

 

APPLICATIONS:

Elemental and its chemical status analysis of surfaces of all elements except hydrogen and Helium:

  • Chemical state identification of surface species, including organic and inorganic materials, conductors and insulators.
  • In-depth composition profiles of elemental distribution in thin films, including semi-conductor thin film structure, magnetic media thin film, optical coating, decorative coating, and wear coating.
  • Composition analysis of samples when destructive effects of electron beam techniques must be avoided.

 

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For more details, please visit our Brochure or Application Notes pages.