PHI-5000 VersaProbe III Introduction



The latest in PHI's scanning XPS microprobe instruments - the VersaProbe III. This multi-technique instrument builds on from our industry-leading patented scanning microprobe technology and dual beam charge neutralization and takes it to an even higher level.


Key Technology

  • New Analyzer input lens with 2-3 times higher sensitivity for all analysis conditions compare to the last VersaProbe II.
  • New Multi-channel detector for faster elemental and chemical imaging
  • New Angle dependent technology for +/- 5 degree solid angle collection for ADXPS measurements
  • Improved Hot/cold stage providing temperatures of -140° C to +800° C
  • New 4-contact transferable sample mount for in-situ controlled potential experiments
  • New UPS design for increased sensitivity and improved energy resolution
  • Improved Auger performance providing higher energy resolution and better signal to noise


Features of the VersaProbe III

  • Micro-Focused Scanning X-ray Source
  • Highly Reliable Automation Technologies
  • Micro Area Spectroscopy
  • Sputter Depth Profiling
  • Multi-Technique Test Chamber
  • SmartSoft-VersaProbe
  • MultiPak Data Reduction Software


Micro-Focused Scanning X-ray Source

The latest in PHI's scanning XPS microprobe instruments - the VersaProbe III. This multi-technique instrument builds on from our industry-leading patented scanning microprobe technology and dual beam charge neutralization and takes it to an even higher level.



The core technology of the VersaProbe III is PHI's patented, monochromatic, micro-focused, scanning x-ray source which provides excellent large area and superior micro-area spectroscopy performance. Spectroscopy, depth profiling and imaging can all be performed over the full range of x-ray beam sizes including the minimum x-ray beam size of less than 10 µm. Unique features this technology provides include:


  • Micro-focused, raster scanned x-ray beam
  • X-ray beam induced secondary electron imaging in just a few ten’s seconds
  • XPS images with spectra at each pixel for retrospective chemical analysis
  • Point or multi-point spectroscopy
  • Point or multi-point thin film analysis


Micro Area Spectroscopy

Superior Micro Area Performance

  • Point and click analysis area definition
  • Robust Auto-Z sample alignment
  • No-tune dual beam charge neutralization
  • Move without concern from insulator to conductor in auto analysis sequences




Highly Reliable Automation Technologies

Turnkey Dual Beam Charge Neutralization

XPS is used to analyze the composition and bonding state of the solid surface of a wide range of materials from conductors to insulators, but the need to set charge neutralization conditions for insulators has been an impediment to automated analysis.

The VersaProbe III resolved this problem by simultaneous irradiation of a low-energy electron beam and an ion beam. This technology now allows turnkey measurement of insulators without burdensome adjustments, enabling overnight automated analysis of conductors and also insulators.



Easy-to-Use Navigation and Automatic Measurement

The SmartSoft software displays observation data (such as intro photos, SXI, and photos taken by a live view camera) and measurement data (such as spectra, profiles, and maps) on the same screen. Specifying an analysis location on the intro photo moves the stage to that location.

In addition, the automatic height adjustment function (Auto-Z) and SXI can easily and accurately define the analysis position where you want to analyze.

Turnkey dual beam charge neutralization and accurate alignment by Auto-Z allow for reliable automatic measurement, improving analysis work efficiency and providing highly reproducible analysis results.




Sputter Depth Profiling

Optimized Configuration

  • Micro-focused x-ray beam
  • High sensitivity spectrometer
  • High performance floating column argon ion gun
  • Turnkey dual beam charge neutralization
  • Compucentric Zalar Rotation
  • Micro-area sputter depth profiling
  • Multi-point sputter depth profiling


Inorganic Sputter Depth Profiling

  • High performance 0-5 keV Ar+ ion gun
  • Low voltage floating column for ultra thin film sputter depth profiling
  • Bend in ion column to stop neutral



Organic Sputter Depth Profiling

  • Optional 10 and 20 kV C60 ion guns
  • Optional 20 kV Ar2500+ gas cluster ion gun
  • Mass filtered cluster ion sources
  • Bend in ion column to stop neutrals



The PHI VersaProbe III has not only achieved micro XPS analysis with three times as high sensitivity as conventional technologies but it has also enabled XPS with the ultimate of depth resolution by introducing an angle resolution mode and low energy argon sputtering.

As shown, in the conventional micro analysis, the solid angle range in which photoelectrons are captured is as large as +/- 20 degrees, which made it difficult to analyze only the outmost surface. In the new angle resolution mode of narrow solid angle range of +/- 5 degrees allows analysis based only on information on the outermost surface. In addition, the introduction of a new argon gas cluster ion gun (Ar-GCIB) now allows sputtering with extremely low energy of 1 keV.



Below shows the results of a depth profile analysis of a film made of layers of Irganox1010, which is commonly used as a plastic additive, and layers of Irganox3114 formed between the Irganox1010 layers in a delta like shape.

While carbon and oxygen are contained in both Irganox1010 (C73H107O12and Irganox3114 (C33H46N3O5 ), nitrogen is contained only in Irganox3114. This can be seen in the detection result of nitrogen represented by delta shapes.

The extremely low energy Ar-GCIB achieves even higher depth resolution.





Whether you are a casual user or an expert, the work flow driven UI and enhanced feature set will increase your productivity.

  • Intuitive single window user interface
  • Session tabs guide you through the analysis process
  • Integrated sample platen management
  • Point and click analysis area definition on saved images
  • User friendly queuing of multiple analysis tasks
  • Multi-point analysis and sputter depth profiling within an imaged area
  • Fully integrated control of optional accessories



MultiPak Data Reduction Software

Data Reduction for XPS and AES

PHI MultiPak is the most comprehensive data reduction and interpretation software package available for electron spectroscopy. The tasks of spectral peak identification, extracting chemical state information, quantification, and detection limit enhancement are addressed with an array of powerful and easy-to-use software tools for spectra, line scans, images and sputter depth profiles. MultiPak can be used on the instrument PC to process data in real time or on an off line PC for report generation.

Advanced Data Reduction Tools

  • Auto peak identification
  • XPS chemical state database
  • XPS spectral deconvolution
  • Quantitative analysis
  • Non-linear least squares fitting
  • Linear least squares fitting
  • Target factor analysis
  • Retrospective chemical imaging
  • Batch mode data processing



Multi-Technique Test Chamber

Integrated Optional Accessories

The VersaProbe III test chamber is designed to accept multiple photon and ion sources that are focused at a common point on the sample and controlled from the SmartSoft-VersaProbe user interface.

  1. Scanning x-ray source
  2. Sample introduction chamber (Optional intro/prep chamber)
  3. Argon sputter ion gun
  4. Electron energy analyzer
  5. Optical Microscope

6a.   Five axis automated sample manipulator  (Optional hot/cold version shown)

6b.   LN2 dewar for sample cooling

7.     Optional sample preparation chambers

8.     Optional C60 sputter ion gun

9.     Optional UV light source for UPS

10.   Optional dual anode x-ray source

11.   Optional electron gun for SAM

12.   Optional 20 kV Ar2500+ gas cluster ion gun




Elemental and its chemical status analysis of surfaces of all elements except hydrogen and Helium:

  • Chemical state identification of surface species, including organic and inorganic materials, conductors and insulators.
  • In-depth composition profiles of elemental distribution in thin films, including semi-conductor thin film structure, magnetic media thin film, optical coating, decorative coating, and wear coating.
  • Composition analysis of samples when destructive effects of electron beam techniques must be avoided.
  • Energy, Environmental, Solar cell, OLED. etc.


Contact CoreTech Marketing & Service team now.


For more details, please visit our Brochure or Application Notes pages.

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