PHI 710 Scanning Auger Nanoprobe



The PHI 710 Scanning Auger Nanoprobe is a unique, high performance Auger Electron Spectroscopy (AES) instrument that provides elemental and chemical state information from sample surfaces and nano-scale features, thin films, and interfaces. Designed as a high performance Auger, the PHI 710 provides the superior Auger imaging performance, spatial resolution, sensitivity, and the spectral energy resolution needed to address your most demanding AES applications.




PHI 710 Scanning Auger Nanoprobe



SEM resolution ≤ 3 nm, AES resolution ≤ 8 nm

In Auger analysis (spectrum, depth profile or mapping), it is necessary to set AES analysis point with SEM image. A fine focused electron beam is required for SEM imaging and an extremely stable electron beam at enough current for AES analysis is required at a time. PHI 710 provides < 3 nm of SEM spatial resolution by reducing the noise from power supply (Fig 1).

AES spatial resolution reached to < 8 nm (@ 20 kV, 1 nA) by adopting an acoustic enclosure box, which minimizes the effect of vibration, sound, and temperature change (Fig.1).


Shows imaging of the grain boundary inclusion from torn surface of a ductile cast iron. A secondary electron image (left), overlaid Auger mapping image for Ca, Mg, & Ti (center), and sulfur Auger mapping image(right) are shown.


It clearly shows that PHI 710 can achieve AES chemical analysis in small scales, like an inclusion only a few dozen nm in size.



Coaxial Analyzer / Electron Gun Geometry



PHI’s coaxial electron gun and analyzer geometry provides the sensitivity and unobstructed vision needed to fully characterize the microstructures that exist on most real world samples with Auger Electron Spectroscopy. In this example, Auger data is obtained from all sides of particulates and between particles with equally high sensitivity.

Cylindrical Mirror Analyzer (CMA) with coaxial field emission electron gun

Imaging of textured or curved samples without analyzer induced shadowing

High sensitivity at all sample tilt angles


Instruments with non-coaxial geometry suffer from geometric effects that dramatically reduce instrumental sensitivity and even create shadows that prevent any analysis in some locations. In this example high sensitivity is only observed on areas of the particles that face the analyzer, while the back side of the particles and the areas between particles are inaccessible because of analyzer shadowing that occurs in an instrument with non-coaxial geometry.



Chemical state mapping by AES

Spectrum mapping

PHI 710 can get spectrum mapping data in Auger mapping analysis, which maintains the spectrum for each pixel. This function provides a chemical state mapping image based on spectral analysis from each pixel.


High energy resolution Auger map

Fig. 5 shows results of Si KLL spectrum mapping measurement of a semiconductor chip electrode. Applying Linear Least Squares Fitting (LLS) data process to the Si KLL spectrum, mapping image clearly shows the three separated areas consisting of elemental Si, Si oxynitride, and metal silicide. Lower column shows the Si KLL spectrum extracted from the map data, for each of the three states.



Nanoscale Thin Film Analysis

The sample shown in the SEM image contains a defect that appeared in a thin nickel film deposited on a silicon substrate after it was annealed to form a nickel silicide at the interface. Multi-point depth profiles obtained with a 20 nm diameter electron beam for analysis and a 500 V Ar ion beam for sputtering were acquired using high energy resolution (0.1%) on and off of the defect. Linear least squared fitting software was used to isolate the Ni metal and Ni silicide spectra as well as the Si metal and silicide spectra. It can be noted that Ni silicide is found only at the interface and not in the Ni film or in the Si substrate at point 1, which is off of the defect. However, in the defect area at point 2 a complex multi-phase Ni silicide is observed throughout the defect in the Ni coating.



SmartSoft-AES Software

  • Intuitive, fully integrated, Windows software platform controls all instrument functions.
  • Session tabs guide you through the analysis process
  • Seamless interface to PHI MultiPak data reduction software



MultiPak Data Reduction Software

PHI MultiPak is the most comprehensive data reduction and interpretation software package available for electron spectroscopy. The tasks of spectral peak identification, quantification, extracting chemical state information, detection limit and image enhancement are addressed with an array of powerful and easy-to-use software tools for spectra, line scans, images and depth profiles.



Optional Accessories

  • In situ sample parking
  • In situ sample fracture apparatus
  • Sample transfer vessel
  • Intro camera
  • EDS Detector
  • EBSD Detector
  • BSE Detector
  • FIB gun



  • Semiconductor device: Defect analysis, etching/clean residue analysis, short circuit problem analysis, contact pollutant analysis, interface diffusion analysis, package problem analysis and FIB device analysis.
  • Display device: Defect analysis, etching/clean residue analysis, short circuit problem analysis, contact pollutant analysis, interface diffusion analysis.
  • Magnetic storage device: Definition of layer and surface element, interface diffusion analysis, hole defect analysis, surface pollutant analysis, magnetic head defect analysis, residue analysis.
  • Glass and ceramic material: Surface deposition analysis, clean pollutant analysis, crystal boundary analysis.


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For more details, please visit our Brochure or Application Notes pages.

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