PHI Ar2500 Gas Cluster Ion Gun is a powerful tool for performing non-destructive depth profiling for many organic and polymeric materials.  The concept for this is similar to that of the Carbon-60 cluster, having the primary beam energy to divide up amongst the 60’s Carbon ion, Ar2500 even further lower the actual impact energy as the cluster consists of 2500 Ar ions.  With such, Ar2500 GCIB is causing much less damage during depth profiling while also avoid the problem of possible ion pile-up by Carbon-60 depth profiling. In overall, Ar2500GCIB makes itself very suitable for depth profiling materials such as polyimide that uses very commonly in the semi-conductor, solar cell and display industries.  This new product by Ulvac-Phi had revealed by AVS (American Vacuum Society) to be the top picks for the Exhibitor Product Awards at the 57th AVS International Symposium and Exhibition that was held October 17-22, 2010 in Albuquerque, NM.


Ulvac-Phi newest Ar2500 GCIB



A piece of PI (Polyimide) sample is got sputtered by different Ar ion beam energy conditions.  Below Table-1 had summarized the XPS Chemical composition conditions for before & after the Ar ion beam sputtering.


Summary of XPS atomic concentration of PI sample before and after each Ar ion beam sputtering condition.


With the result, we know that Ar ion beam sputtering will cause serious Chemical damage to the PI sample.  The damaged samples are then analyze by XPS together with Ar2500 GCIB sputtering depth profile.  As Fig.2 shown, the Ar2500 GCIB can be used very efficient in removing the damaged layer and get back to the correct PI layer Chemical structure, hence proving no Chemical damage during sputtering even on polymer like PI samples.


Illustration of using Ar2500 GCIB to remove the damage layer of surface PI by Ar ion sputtering, and return sample condition back to original PI


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